Laser-Induced Dicing System for Silicon Carbide Wafers
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
■ Specifications:
◆ Processing object: silicon carbide wafers
◆ Laser type: Infrared picosecond pulsed laser
◆ Laser power: ≥4W
◆ Cooling method: air-cooled
◆ X-axis: stroke 450mm, resolution 0.1um
◆ Y-axis: stroke 700mm, resolution 0.1um
◆ Z-axis:stroke 20mm,resolution 0.1um
◆ θ axis: travel 120°, resolution 0.001°
◆ Maximum cutting thickness: 1mm
◆ Maximum speed value of cutting axis: 500mm/s
◆ Processing size: 6" (upgradeable to 8")
■ Advantages
◆ Fast cutting speeds; high-quality results; high yield rates
◆ Complete process solution available (including wafer breaking and expansion equipment)
◆ Mature processing technology; applicable to various types of silicon carbide wafers
■ Applications
Wafer cutting of microwave devices and power devices used in the aerospace, power electronics and other industries (wafer taking silicon carbide materials as the substrate)
■ Samples
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