Fully Automatic Glass Laser Chamfering System-Display-Laser Etching Equipment|Wafer Dicing Equipment-Suzhou Delphi Laser Co., Ltd.

■ Specifications:

Model	AGC39	AGC20
Cutting substrate	Glass
Working area	400mm×300mm，Support 1~12inch
Types of cuts	Right angle / R angle / U slot, water drop screen and other shaped full-screen
Equipment Structure	1 cutting head + 2 platforms	2 cutting heads + 4 platforms
Tact time	C corner 2.5 seconds, R corner 4.5S, C+R+U 6 seconds	C corner 2 seconds, R corner 4.5 seconds, C+R+U 6 seconds
Cleaving method	Mechanical /Ultrasonic

■ Advantages:

◆ Our independently developed ultra-short pulse picosecond infrared laser, widely acclaimed in the display industry for its extensive application experience, has earned high praise from numerous customers.

◆ Paired with our independently developed invisible thread cutting optical structure, ensuring high-quality cutting results.

◆ With years of automation experience, we provide customers with a high-quality and stable automated operating environment.

■ Applications:

Applied to glass screens for mobile phones, smart wearable devices, vehicle displays, and other applications.

■ Samples