Model：LUT-800； Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
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Model：LLO-8600； The system uses laser lift-off technology to peel off Micro LED wafers.
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Model：DLDS-8680； The system is used for laser slicing processing of silicon carbide ingots/pieces. After the laser processing is completed, it is used with an auxiliary dicing device to complete wafer dicing after slicing. The material loss is small, while the processing efficiency is high. No consumables are required to operate the equipment, and the processing cost is low.
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Model：ALS03； The system is used for etching the internal series circuits of perovskite thin film solar cells. The system integrates a variety of laser sources and can complete P1/P2/P3 scribing and P4 edge cleaning in the perovskite cell production process.
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Model：CAT10； This system is designed for the automatic processing of insulation film removal in the battery cell rework process. It is equipped with a laser processing system and an automatic film removal system.
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Model：LGC52； The system achieves high-speed and stable cutting of UTG through the customized development of a special optical shaping system and processing software.
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Model：LGC71； This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.
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Model：DRP02/03/15； The equipment is designed for automated processing of large-format FPC (Flexible Printed Circuit) soft boards, cover films, COF (Chip on Film), CPI (Chip Package on Interposer), and adhesive products used in the automotive industry.
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The system is mostly equipped with self-produced ultrafast lasers. Improve system performance, reduce cost and ensure timely delivery. We can develop laser with laser process.
More than ten years of accumulation of laser fine micro processing, providing laser solutions for various ultra-thin, ultra-hard, brittle, flexible and transparent materials.
Various transfer and robot handling technologies available，Many years of automation experience to provide customers with a stable automation operating environment.
Micro LED Wafer Laser Mass Transfer System
Micro LED Wafer Laser Lift Off System
Silicon Carbide Wafer Laser Processing System
Thin Film Solar Cell Laser Integrated Processing System
Battery Cell Film Laser Removal System
UTG Glass Laser Cutting System
HUD Curved Glass Laser Cutting System
Large-format Vehicle-mounted FPC/cover Film Roll-to-sheet Processing System
In the field of new electronics, it is mainly used in cutting, drilling, and etching flexible circuit boards (FPC), printed circuit boards (PCB), ceramics, electric vehicle glass, automotive head-up display glass, LCP/MPI antennas, PET thin films, etc. Especially along with the development of new energy vehicles, the demand for precision processing of related soft boards, vehicle glass, etc. has given rise to more applications of ultraviolet and ultrafast lasers. The company launches supporting laser processing solutions for applications in the fields of automotive electronics, 5G, and consumer electronics.
Electronics Industry
Some of our laser solutions for display applications include laser cutting, marking, drilling, repair, and the peeling of flexible materials, conductive films, glass, and other materials. These solutions are widely used in LCD, OLED, and Mini&Micro LED, covering all product sizes from 0.9 inches to 110 inches.
Display Industry
The variety of laser solutions for semiconductor applications includes stealth dicing of LEDs, wafers, Si wafers, and silicon carbide/gallium arsenide/gallium nitride; wafer/chip marking; TGV laser drilling; laser annealing; laser debonding; Micro LED laser lift-off (LLO); laser-based mass transfer; and laser repair. Materials that can be processed include compound semiconductor wafers made of diamond, sapphire, quartz, optical glass, silicon, silicon carbide, gallium arsenide, and gallium nitride among others.
Semiconductor Industry
In the field of new energy, we deploy new energy applications such as lithium-ion batteries and photovoltaics. Our solutions include: perovskite thin film solar cell production equipment; printing screen laser plate making equipment; intelligent equipment related to lithium-ion and hydrogen fuel power cells; power system energy storage, base station energy storage, and home energy storage battery-related intelligent equipment.
New Energy
In November, the autumn breeze in Suzhou is just right, and Delphi Laser's annual marathon event is once again underway. The people of Dephi Laser, with their spirited attitude, measure the earth with their footsteps and write perseverance with their sweat. Wonderful Moments On the racecourse, the athletes from Delphi Laser showed exceptional style, surpassing themselves, moving forward courageously, and never giving up! It is worth mentioning that the female participants in this year's marathon competition were no less than their male counterparts, becoming a beautiful sight on the track. Award Group Photos 20km Group 10km Group 5km Women’s Group 5km Men’s Group Team Award: Operations Center Running never stops, and innovation continues without end. All employees of Delphi Laser will approach their work and life with greater enthusiasm, a strong body, and a spirited attitude. Looking ahead, Delphi Laser will run hand-in-hand with partners both inside and outside the industry to create brilliance together! Looking forward to next year’s Delphi Laser Marathon, continuing to create even more wonderful moments!
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Material Innovation, Empowering Development Delphi Laser As the foldable smartphone market continues to surge, innovative materials have become the key to advancing this technology. This has heightened the demand for high-precision laser processing equipment. Delphi Laser, with its deep expertise and commitment to innovation, has strategically positioned itself in the foldable screen market. Its equipment has been successfully deployed in production lines, earning high recognition from clients and providing precise, efficient solutions for intelligent manufacturing in every detail of foldable smartphones. 1、Cover Glass Processing Delphi Laser 1）UTG Glass Cutting System Ultra-Thin Glass (UTG) is increasingly favored for foldable display covers due to its ultra-thin, flexible, highly transparent, and high-temperature-resistant properties. Addressing the growing demand for UTG, Delphi Laser offers specialized UTG glass cutting equipment that ensures high-efficiency, precise cutting, enhancing production efficiency and yield rates. Advantages: Non-contact processing minimizes material damage and operating costs. High-speed, precision cutting with CCD vision alignment. Direct CAD import for quick and efficient cutting of various shapes. Industrial-grade design ensures stable 24/7 operation. Optional automated loading/unloading for increased efficiency and reduced labor. Samples： 2）CPI Laser Precision Micro-Processing System Transparent Polyimide (CPI), a critical material for foldable screens, offers stable performance, technical maturity, and cost advantages. Delphi Laser's CPI micro-processing equipment delivers high-precision, efficient cutting tailored to this key material. Advantages: High-speed processing with excellent precision, boosting productivity. Minimized thermal effects, reducing edge chipping. Advanced processing systems enable precise parameter and pattern matching. 3）Film Cutting and Stripping Integrated System This automated solution protects display covers from scratches and stains by efficiently handling film application and stripping. Delphi Laser’s cutting-edge design integrates laser cutting, vision alignment, and automated systems for seamless operation. Advantages: Automated tray transfer and robotic loading enhance productivity. Precision alignment ensures accurate cutting and film application. Customizable settings for various dimensions and positions. Stable, long-term operation supported by high-quality materials and software. 2、Carbon Fiber Processing Delphi Laser Carbon Fiber Cutting System Carbon fiber, known for its lightweight and high-strength properties, is essential in foldable smartphone structural designs. Delphi Laser’s advanced carbon fiber cutting equipment ensures smooth, burr-free edges and optimized production efficiency. Advantages: High-speed, precise cutting reduces thermal effects and edge damage. Integrated systems for automated loading, cleaning, waste removal, and inspection. High-power laser systems developed in-house for cost-effective, high-performance processing. Samples： 3、Metal Hinge Processing Delphi Laser Hinge Laser Welding System Metal hinges are critical components in foldable smartphones, providing structural support and enabling various folding mechanisms. Delphi Laser’s laser welding equipment ensures precise, high-quality welding for hinges, accommodating a variety of materials and designs. Advantages: Fast Welding Speed: Laser welding achieves high speed, significantly enhancing production efficiency and meeting the rapid manufacturing demands of foldable smartphones and other electronic products. Non-Contact Welding: As a non-contact process, laser welding minimizes stress impact on metal components. Controllable Welding Depth: By adjusting laser power and beam focus, precise control of welding depth is achieved, preventing defects from excessive or insufficient penetration. High Adaptability: Laser welding technology accommodates various sizes, shapes, and materials of metal hinges, offering greater design flexibility for foldable smartphones. Samples： 4、Flexible OLED Processing Delphi Laser 1）Fully Automated Flexible OLED Shaped Cutting System This system is capable of easily handling complex shapes and curved cutting requirements. It precisely addresses the intricate folding shapes of smartphones. The equipment is primarily used for the fine-tuning and processing of AMOLED module segments, where the OLED panels are integrally cut by laser to improve edge precision and achieve irregular shape cutting. The system is equipped with an automatic image positioning system, multiple feeding and unloading interfaces, AOI (Automatic Optical Inspection), and USC (Ultrasonic Cleaning), ensuring efficient high-speed cutting and stable, high-quality operation. Advantages: It uses a UV picosecond/femtosecond laser combined with a galvanometer scanning system, enabling fast irregular shape cutting. Cutting quality: HAZ (Heat-Affected Zone) ≤ 50μm Cutting precision: CPK ≥ 1.33 (@±30μm) Fully automated Inline/Offline design, further reducing labor costs Compatible with OCA integrated cutting Samples： 2）Fully Automated Flexible OLED Laser Drilling System The core of a foldable smartphone lies in its foldable screen, which must maintain excellent performance and appearance during both folding and unfolding. Delong Laser's fully automated flexible OLED laser punching equipment is specifically designed for the AMOLED module display area. It uses advanced laser technology for punching the OLED panels in the AMOLED module to expose components such as the camera and other devices. By precisely controlling the laser energy and beam quality, it provides a reliable solution for manufacturing flexible display devices. Advantages: Utilizes UV femtosecond laser with a scanning galvanometer system to meet the demand for fast laser punching. Cutting quality: HAZ ≤ 40μm, no cracks, no rainbow patterns. Cutting precision: CPK ≥ 1.33 (@ ±30μm). Samples： 3）OLED/LCD Laser Repair System In the development of foldable smartphones, the perfect presentation of each pixel is an unwavering pursuit of quality. Delong Laser's OLED/LCD laser repair equipment is equipped with high-precision laser technology and advanced AOI (Automated Optical Inspection) technology, providing excellent imaging quality. The chosen control system components are highly precise, enabling the automatic detection and accurate positioning of OLED/LCD screen hotspots. Whether dealing with bright spots, weak bright spots, or partial dark spots, laser repair can be performed. The equipment features a compact structure and operates stably and reliably. Key Advantages: The equipment features a compact structure with a well-organized layout. It offers excellent compatibility. The motion system is stable and responsive. It delivers high precision, user-friendly interfaces, and easy maintenance. A strong technical team provides robust support for equipment installation, commissioning, and after-sales maintenance. Samples： 5、PCB/FPC Processing Delphi Laser Picosecond Laser Precision Micro-Processing System PCB and FPC play crucial roles in foldable smartphones, together forming the complex and precise circuit system that ensures the normal operation and exceptional performance of the device. Delphi Laser's picosecond laser fine processing equipment, with its high precision, efficiency, and stability, is widely used in the fine processing fields of cutting, lid opening, and other applications for PCB, FPC rigid-flex boards, and related materials in foldable smartphones. The equipment utilizes advanced picosecond laser technology, meeting the stringent processing precision requirements for high-end electronic products such as foldable smartphones. Key Advantages: The equipment uses an independently developed high-power ultraviolet picosecond laser, offering high cost-effectiveness. It effectively controls the processing results, improving product edge collapse and thermal effects. The self-developed dual-station processing system is stable and reliable, significantly improving processing efficiency. The mature process system accurately calculates and splits graphics, ensuring the precise matching of processing parameters and design patterns. Innovation never stops, empowering the future Delphi Laser Future Outlook Delphi Laser remains committed to innovation and excellence in laser micro-processing. By continuously advancing its technology, Delphi Laser empowers intelligent manufacturing, shaping the future of foldable smartphones and beyond.
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As a global trendsetter in the photovoltaic industry, the three-day 17th International Solar Photovoltaic and Smart Energy Conference & Exhibition (2024 SNEC) concluded successfully in Shanghai on June 15. Delphi Laser showcased perovskite thin-film solar cell laser applications, advanced crystalline silicon manufacturing solutions, and screen printing laser applications, attracting significant attention from exhibitors and industry clients worldwide. Perovskite GW Line Laser + Packaging Integrated Solution This equipment is used for etching the internal series circuit of perovskite thin-film solar cells. The equipment integrates multiple laser sources and can complete P1/P2/P3 scribing, P4 edge cleaning, P5 light-transmitting component processing, and P6 cutting and splitting in the perovskite cell production process. Roll-to-Roll Flexible Thin-Film Solar Cell Laser Scribing System This equipment is uses high-energy lasers for scribing on glass surfaces. Depending on the laser configuration, different processes can be performed. The equipment's components are efficiently integrated to achieve high-precision, high-speed scribing, and etching processes. BC Cell Laser De-coating Isolation Processing System This equipment is used for de-coating BC cells. It enhances the performance of the back passivation layer by reducing carrier recombination loss at the interface, thereby improving photoelectric conversion efficiency. TOPCon Laser Enhanced Sintering System This equipment is designed to improve contact resistance in crystalline silicon solar cells. It reduces metal-semiconductor recombination loss, improving the contact resistance between the electrode grid and the crystalline silicon cell, thereby enhancing the photovoltaic conversion efficiency of crystalline silicon cells. High-Precision Laser Screen Etching System This equipment is equipped with an ultrashort pulse UV laser, combined with high-performance peripheral components. It is primarily used for drilling and cutting PI and other materials. It can process photovoltaic and non-photovoltaic patterns on PI screens and is also capable of processing SE screens and knotless screens at the current stage. Delphi Laser looks forward to seeing you next time. Stay tuned to Delphi Laser!
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