PRODUCTS

Micro LED Wafer Laser Mass Transfer System

Model:LUT-800; Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.

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Wafer-Level Laser Micro-Drilling System(TGV)

Model:AWD20; This fully automated laser system is designed for Through-Glass Via (TGV) microhole processing on wafer-level glass substrates of various materials with thicknesses ranging from 0.1 to 1 mm. It supports the fabrication of various via structures, including blind holes and conical through-holes.

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Thin Film Solar Cell Laser Integrated Processing System

Model:ALS03; The system is used for etching the internal series circuits of perovskite thin film solar cells. The system integrates a variety of laser sources and can complete P1/P2/P3 scribing and P4 edge cleaning in the perovskite cell production process.

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Post-Molding Marking System(Rail-Type + Stack/Slot Loading/Unloading)

Model:APM12; The Fully Automatic Laser Marking Machine is designed for marking post-packaging products. It supports both slot magazine and stack magazine loading/unloading methods. Based on customer process requirements, the machine can be configured in 1-in-1-out or 2-in-2-out models.

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Laser Roller Cleaning System

Model:PRC series; Special optical design, non-destructive roller surface, capable of matching maximum operating speed ≥120 meters per minute.

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Roll-to-Roll Laser Baking System

Model:RLH series; This system is primarily used for laser heating and dewatering of the positive and negative electrode sheets of lithium batteries.

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HUD Curved Glass Laser Cutting System

Model:LGC71; This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.

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Carbon Fiber Cutting Application System

Model:FPS20/FPS24/FPS27; This equipment utilizes a high-energy customized laser to efficiently cut carbon fiber and other foldable display materials. The cut edges are smooth, burr-free, and free of burn marks, with fast processing speed. Equipped with an automatic vision positioning system and environmental safety features, the system ensures safe and high-speed automated cutting.

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The system is mostly equipped with self-produced ultrafast lasers. Improve system performance, reduce cost and ensure timely delivery. We can develop laser with laser process.

More than ten years of accumulation of laser fine micro processing, providing laser solutions for various ultra-thin, ultra-hard, brittle, flexible and transparent materials.

Various transfer and robot handling technologies available,Many years of automation experience to provide customers with a stable automation operating environment.

Micro LED Wafer Laser Mass Transfer System

Wafer-Level Laser Micro-Drilling System(TGV)

Thin Film Solar Cell Laser Integrated Processing System

Post-Molding Marking System(Rail-Type + Stack/Slot Loading/Unloading)

Laser Roller Cleaning System

Roll-to-Roll Laser Baking System

HUD Curved Glass Laser Cutting System

Carbon Fiber Cutting Application System

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SOLUTIONS

Electronics Industry

We offer laser applications for cutting, marking, drilling, etching, and welding on materials such as glass, ceramics, circuit boards (FPC/PCB), thin films, and metals—mainly for the automotive and consumer electronics sectors. For foldable devices, we provide comprehensive solutions covering cover glass, carbon fiber, metal hinges, OLED displays, circuit boards, and automation systems.

Electronics Industry

Display Panel Industry

We primarily offer solutions for cutting and repair of TFT-LCD, AMOLED, and Mini LED displays, as well as peeling, transfer, and repair processes for Micro LED wafers.

Display Panel Industry

Semiconductor Industry

We mainly provide laser dicing for various wafer materials such as silicon, silicon carbide, gallium arsenide, lithium tantalate, lithium niobate, and glass. Key solutions include wafer laser grooving, silicon carbide ingot slicing, silicon carbide laser annealing, Through Glass Via (TGV), laser grooving (low-k), edge trimming, wafer marking, module drilling (TMV), laser debonding, and assisted welding for advanced packaging applications.

Semiconductor Industry

Lithium Battery Industry

We have launched a range of innovative laser intelligent equipment for lithium battery manufacturing, including front-end process solutions and mid-to-back-end laser solutions. Our technology also supports solid-state battery production through roller cleaning and laser baking, and we provide precise disassembly solutions for lithium battery recycling and reuse.

Lithium Battery Industry

Photovoltaic Industry

We supply complete production equipment for perovskite thin-film solar cells, including P0 laser marking, P1–P3 laser scribing, P4 edge deletion, material transfer and buffering systems, as well as downstream encapsulation and inspection equipment. We are also developing new products for crystalline silicon and BC cell photovoltaic technologies.

Photovoltaic Industry

NEWSROOM

Delphi Laser Shines at CIBF 2025: Precision Laser Micromachining Empowers Smart Lithium Battery Manufacturing

From May 15 to 17, 2025, the highly influential battery industry event - the 17th Shenzhen International Battery Fair (CIBF2025) was grandly held in Shenzhen. Delphi Laser showcased multiple advanced lithium battery manufacturing solutions including roll-to-roll laser baking equipment, roller press laser online cleaning systems, lithium battery echelon utilization, and 500W femtosecond lasers.Using precision laser micromachining technology to empower intelligent lithium battery manufacturing, Delphi Laser's booth attracted tremendous popularity and became the focal point of the exhibition! Focusing on details and continuous innovation. At this year's CIBF2025, Delphi Laser concentrated on technological innovation, bringing multiple industry-first innovative solutions that focused on the entire process upgrade in the lithium battery field, attracting extensive attention from numerous exhibition visitors and partners. During the exhibition, Delphi Laser also gave presentations on topics including laser drying, all-solid-state battery applications, ultrafast lasers, and battery pack laser disassembly processes, engaging in in-depth exchanges and discussions with many industry professionals on site to share the latest research and application achievements. Presentation scene  Accepted live interview by Gaogong Cloud Exhibition  Delphi Laser looks forward to meeting you next time! Please continue to follow Delphi Laser!

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Delphi Laser Wins 25th China Patent Award

Recently, the China National Intellectual Property Administration (CNIPA) announced the eva1uation results of the 25th China Patent Awards. Suzhou Delphi Laser Co., Ltd. was honored with  the "China Patent Excellence Award" for its patent titled "Device and Method for Asymmetric Beam Splitting Laser Processing of Transparent Materials", further demonstrating the company's  strength in technological innovation. Since its establishment in 2005, Delphi Laser has consistently aligned with national R&D demands, placing high importance on intellectual property (IP) and actively advancing its IP-driven  corporate strategy. The company has set up a dedicated IP management department, formulated strategic IP plans, and enhanced overall IP awareness. These efforts have earned it the titles of "National Intellectual Property Advantage Enterprise (2019)" and "National Intellectual Property Demonstration Enterprise (2022)". Moving forward, Delphi Laser will continue to uphold the principle of innovation-driven development, leverage its exemplary role, increase R&D investment, and actively explore new technologies  and applications to enhance its core competitiveness. The company remains committed to achieving its goal of becoming a globally competitive IP powerhouse. About the China Patent Awards: Co-organized by the CNIPA and the World Intellectual Property Organization (WIPO), the China Patent Awards represent the only government-backed accolade in China that recognizes outstanding  patented inventions. The awards aim to strengthen IP creation, protection, and utilization, promote high-quality economic development, and honor patentees and inventors (designers) who have made  significant contributions to technological innovation and socio-economic progress.

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