This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website

Coil has boundaries, die-cutting has no boundaries

Enrich coil product structure

Upgrade industry level

Enhancement of industrial potential

Actively promote the application of materials market and die-cutting processing technology progress

"APFE" 16th Shanghai International Coil & Die Cut Exhibition

Will be on September 28-30, 2020

Held at Shanghai National Convention and Exhibition Center (Shanghai-Hongqiao)

Delphilaser Booth No.: Hall 7.1 5A250

With laser technology as the means, in recent years, around the new infrastructure and communication industry, Delphilaser has cut from 3C and 5G to provide excellent related products and application solutions for global smart manufacturing.

Within the 3C and 5G industry, Delphilaser equipment can be applied to: base station antennas, RF devices, optical devices/optical modules, chips, dielectric waveguide filters, millimeter wave antennas, etc..

Processable materials are: LCP/MPI/COF/COP/PI/CPI and other 5G materials; FPC, PCB, FR4; auxiliary materials such as blue film backing, gold and silver foil, foam adhesive, covering film and other adhesive film types; ferrite, etc.

In this exhibition, we will show you a variety of laser fine processing solutions related to coil and die-cutting, and there are professional technical staff on site to answer your questions.

FPC/FCB industry laser application solutions

UV picosecond fine micromachining equipment for 5G communication devices

The equipment is a set of special equipment developed for Cutting and grooving of LCP/MPI/COF/COP/PI/CPI and other 5G materials and adhesive products in the consumer electronics industry. The equipment integrates a high-speed, high-precision optical processing system, an independent process, and a processing path optimization system, which can accurately Cut the shape and control the half-cut depth. The application of ultra-short pulse UV laser has greatly improved the processing quality of products.

UV Nanosecond Laser Cutting Equipment

The equipment is mainly for FPC, PCB sheet Cutting, open cover and other processing applications, and in the camera module, fingerprint recognition and other Applications outstanding performance, can also be mainly including polyimide and other polymer materials, ceramics, quartz, and other non-metallic materials, as well as tungsten copper and other various metal and alloy materials processing.

Mulch film processing application equipment

This machine is designed for roll-to-sheet and roll-to-roll automatic processing of cover film, COF, CPI and adhesive products. This machine is equipped with single optical path and double optical path systems, etc., with high Processing accuracy and fast Processing speed. 

Wireless Charging FieldsCutting Application Devices

The equipment uses high energy (green light) laser for efficient Cutting of ferrite and other wireless charging materials. The edges of the products after Cutting are smooth and burr-free, with no black edges and fast efficiency. The equipment is equipped with automatic image positioning system and environmental safety system to provide automatic high speed Cutting of products.

FR4 sheet Cutting application equipment

The equipment uses high energy (green light) laser for efficient Cutting of FR4. The edges of the products after Cutting are smooth and burr-free without black edges, and the equipment is equipped with automatic image positioning system and environmental safety system for automatic high-speed Cutting of the products.

Laser application solutions for die-cutting industry

Die-cutting and proofing equipment

The equipment is a set of roll-to-roll laser die-cutting equipment, with automatic laminating and waste discharge, self-correction, secondary three times alignment, to achieve no knife mark process, for adhesive products: FPC stainless steel backing, pressure-sensitive adhesive, SONY adhesive, AB adhesive, 3M, TESA double-sided adhesive / hot melt adhesive, black and white adhesive, self-adhesive, double-sided adhesive, easy to tear stickers, PE foam adhesive, PI / blue film backing, die-cutting conductive adhesive, etc.. Equipment integrated with high-speed, high-precision optical processing system, independent process, processing path optimization system, can accurately Cutting shape and control the depth of half-cut. Ultra-short pulse picosecond UV laser application, a large improvement in product processing quality.

DRR11 picosecond laser device 

This machine is designed for roll-to-sheet and roll-to-roll automatic processing of cover film, COF, CPI and adhesive products, with high Processing accuracy and fast Processing speed.

Products include: backing, pressure-sensitive adhesive, SONY adhesive, AB adhesive, 3M, TESA double-sided adhesive/hot melt adhesive, black and white adhesive, self-adhesive, double-sided adhesive, easy-peel sticker, PE foam adhesive, PI/blue film backing, special equipment for die-cutting conductive adhesive, etc.
The equipment integrates high speed and high precision optical processing system, independent process, processing path optimization system, which can accurately Cutting shape and control the half-cut depth. Ultra-short pulse UV laser application greatly improves the processing quality of products.

In addition, there will be equipment on display, so stay tuned!

This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website

For more information about our products and applications, please visit our website at:

Delphilaser official website:www.delphilaser.com

Ali store:tbdelphilaser.com

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