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Silicon Carbide Wafer Laser Cutting Systerm
Model：Inducer-5560
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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UV Picosecond Laser Micromachining System
Model：DPS15/21/22/31
This system is specifically developed for cutting and engraving LCP/MPI/COF/COP/PI/CPI materials and adhesive products.
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Post-Molding Marking System (Carrier-Type + Stack/Slot Loading/Unloading)
Model：APM13
This system is designed for marking post-packaging products. It supports both slot magazine and stack magazine loading/unloading methods and can be configured into 1-in-1-out or 2-in-2-out models according to customer process requirements.
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FC Product On-Boat Marking System (Slot Loading/Unloading)
Model：ATM50
This fully automatic equipment is designed for advanced packaging processes, suitable for marking FCBGA substrates on components such as the ring, heat spreader (electroplated type), and silicon. It supports customizable text formats including QR codes, c
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IC in Tray Marking System (Tray Loading/Unloading)
Model：ATM30
Designed for single IC package products, this machine offers precise positioning and features self-inspection capabilities. Optional pick-and-place functionality can be configured according to customer requirements.
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Board Edge 2D Marking System
Model：APM71
This system is used for engraving 2D IDs on strips and lead frame substrates to facilitate traceability throughout subsequent processing steps.
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Tab-lead Laser Die-cutting and Cutting Integrated system
Model：
This equipment is used for slitting battery electrode sheets with tabs after die-cutting.
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Wafer Laser Grooving System
Model：AS-5380
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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