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Roll-to-Roll Thin Film Laser Etching System
Model:Etching/Cutting
This device realizes laser roll-to-roll processing, capable of etching, cutting, marking, and other functions.
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CO2 Laser Ceramic Scribing System
Model:CPP12/21/30
This system is primarily used for laser scribing of ceramic substrates in the DBC (Direct Bond Copper) industry.
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Fiber Laser Ceramic Cutting System
Model:RPP05/12/15/20/22
This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
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LTCC/HTCC Laser Drilling and Etching System
Model:
The system is mainly used for the rapid processing of through-holes, partial holes, and cavities in LTCC (Low Temperature Co-fired Ceramic) green bodies, ferrites, and other materials.
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Glass Laser Drilling System
Model:LGE10
This system efficiently drills glass using high-energy lasers, resulting in small burrs, high precision, and excellent quality.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
Model:LMS10
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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OLED/LCD Laser Repair System
Model:
It is mainly used for repairing defective pixels on flexible OLED panels and LCD liquid crystal panels. It automatically detects defects using AOI (Automated Optical Inspection) systems and uses laser technology to repair these defects.
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PCB Laser Precision Drilling System
Model:
The processing target is PCBs, suitable for blind and through-hole operations on double-sided copper-clad boards. It can also be equipped with a roll-to-roll mechanism for processing rolled materials.
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