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Silicon Carbide Wafer Laser Processing System
Model：DLDS-8680
The system is used for laser slicing processing of silicon carbide ingots/pieces.
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Micro LED Wafer Laser Lift Off System
Model：LLO-8600
The system uses laser lift-off technology to peel off micro-LED wafers.
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Large-format Vehicle-mounted FPC/cover Film Roll-to-sheet Processing System
Model：DRP02/03/15
The equipment is designed for automated processing of large-format FPC (Flexible Printed Circuit) soft boards, cover films, COF (Chip on Film), CPI (Chip Package on Interposer), and adhesive products used in the automotive industry.
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UTG Glass Laser Cutting System
Model：LGC52
The system achieves high-speed and stable cutting of UTG through the customized development of a special optical shaping system and processing software.
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Automotive Electrochromic Film Laser Processing System
Model：DLC15
This equipment is primarily used for cutting and etching flexible polymer materials such as CPI, PET, and electrochromic films.
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Femtosecond Five-Axis (Galvo) Laser Precision Machining system
Model：LPD20
This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
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Fully Automatic Glass Laser High-Speed Cutting System
Model：LGC20/30/40
This system utilizes high-energy infrared femtosecond pulse laser for specialized shaping and efficient cutting of glass. It has been widely applied in fields such as smart wearables, household appliances, security systems, and mobile phone cover panels.
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LCD Terminal Cutting System
Model：
This system is mainly used for terminal cutting of LCD products.
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