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Automotive Electrochromic Film Laser Processing System
Model：DLC15
This equipment is primarily used for cutting and etching flexible polymer materials such as CPI, PET, and electrochromic films.
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Femtosecond Five-Axis (Galvo) Laser Precision Machining system
Model：LPD20
This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
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Fully Automatic Glass Laser High-Speed Cutting System
Model：LGC20/30/40
This system utilizes high-energy infrared femtosecond pulse laser for specialized shaping and efficient cutting of glass. It has been widely applied in fields such as smart wearables, household appliances, security systems, and mobile phone cover panels.
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LCD Terminal Cutting System
Model：
This system is mainly used for terminal cutting of LCD products.
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Silicon Carbide Wafer Laser Cutting Systerm
Model：Inducer-5560
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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UV Picosecond Laser Micromachining System
Model：DPS15/21/22/31
This system is specifically developed for cutting and engraving LCP/MPI/COF/COP/PI/CPI materials and adhesive products.
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Tab-lead Laser Die-cutting and Cutting Integrated system
Model：
This equipment is used for slitting battery electrode sheets with tabs after die-cutting.
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Wafer Laser Grooving System
Model：AS-5380
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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